Arthropod Robots White Papers

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Can Your Data Center Infrastructure Handle the Heat of High Density
sponsored by CyrusOne
WHITE PAPER: High density computing is today's standard in best-in-class performance and availability, and those that fail to keep pace or fall behind will find themselves no longer competitive in today's markets.
Posted: 11 Aug 2008 | Published: 01 Aug 2008

CyrusOne

Dell PowerVault MD3000 1000 Mailbox Local Continuous Replication Microsoft Exchange 2007 Storage Solution
sponsored by DellEMC and IntelĀ®
WHITE PAPER: This white paper describes a tested and validated storage solution for a 1000 mailbox Exchange Server 2007 environment with Local Continuous Replication (LCR) feature.
Posted: 27 Aug 2008 | Published: 27 Aug 2008

DellEMC and IntelĀ®

Improving the mobile experience through solid state drive
sponsored by Intel Corporation
WHITE PAPER: Intel IT is evaluating solid-state drive (SSD) technology to better understand the benefits to users and the impacts on the enterprise. We have initiated a proof of concept (PoC) study that includes extensive benchmark testing as well as deployment of notebooks with SSDs to the Intel workforce.
Posted: 27 May 2009 | Published: 05 Jan 2009

Intel Corporation

High Availability for SQL Server 2005 Using array-based Replication and Host-based Mirroring Technologies
sponsored by Hewlett Packard Enterprise
WHITE PAPER: This paper provides the data needed to understand the options and the limitations for implementing remote replication solutions on a clustered HP server and storage area network (SAN)-based storage infrastructure.
Posted: 12 Mar 2008 | Published: 01 Jan 2008

Hewlett Packard Enterprise

Managing Extreme Heat: Cooling Strategies for High-Density Systems
sponsored by Liebert Corporation
WHITE PAPER: The Liebert XD family is the first complete solution to extreme density cooling, providing a scalable, flexible solution that can be optimized for new and existing data centers. Live?
Posted: 29 Sep 2004 | Published: 01 Sep 2004

Liebert Corporation

First the Tick, Now the Tock: Next Generation Intel Microarchitecture - Nehalem
sponsored by Intel Corporation
WHITE PAPER: Read this paper and get a look at how the next generation microarchitecture's dynamically scalable and design-scalable features directly contribute to power efficiency and performance.
Posted: 03 Apr 2009 | Published: 02 Apr 2009

Intel Corporation

NetBackup Disk Based Data Protection Options
sponsored by Symantec Corporation
WHITE PAPER: This paper explains the disk options and their capabilities as well as the other new features in NetBackup 6.5 that make up the Enterprise Disk Foundation, also it provides guidance in choosing the appropriate disk options for your environment.
Posted: 03 Jun 2008 | Published: 01 Oct 2007

Symantec Corporation

Unlocking the Full Power of Massive Parallelism: Solving the Network Bottleneck in MPP Databases
sponsored by Aster Data Systems
WHITE PAPER: This paper describes the technical limitations inherent in the architecture of traditional databases and other MPP (massive parallel processing) alternatives.
Posted: 09 Dec 2008 | Published: 09 Dec 2008

Aster Data Systems

Going Parallel with LabVIEW Delivers Throughput Gains
sponsored by National Instruments
WHITE PAPER: In this whitepaper learn how by combining technologies with NI Lab VIEW parallel programming software and NI TestStand test management software, test engineers can create high-performance test systems.
Posted: 16 Sep 2008 | Published: 16 Sep 2008

National Instruments

Intel® Xeon® Processor 5500 Series: An Intelligent Approach to IT Challenges
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel