Discrete Component Packaging White Papers

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Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions
sponsored by Emerson Network Power
WHITE PAPER: High heat in critical spaces compromises availability. This paper discusses the pros and cons of different cooling fluids and system architectures, and explores the role of supplemental cooling technologies as data center densities increase.
Posted: 07 Jul 2009 | Published: 07 Jul 2009

Emerson Network Power

Rack Powering Options for High Density
sponsored by Schneider Electric
WHITE PAPER: In this APC whitepaper, alternatives for providing electrical power to high density racks in data centers and network rooms are explained and compared as well as defined guidelines for rack power systems that can reliably deliver power to high density loads while adapting to changing needs.
Posted: 01 Apr 2010 | Published: 09 Jul 2009

Schneider Electric